Electronics Articles Archive
The Schottky diode is a two terminal device which is used in various applications such as mixer, ac to dc converter. The Schottky barrier diode is also known as “ hot carrier diode” or “surface barrier diode”.
In BJT configuration it requires two ports network namely input port and output port. The input port are require 2 input terminal and the output port require 2 output terminal therefore it requires 4 terminals due to
The optical fibers have greater information carrying capacities than metallic conductors. The optical fiber are lighter and smaller. The optical fiber cables are cheaper to transport and easier to install than metal cables. The optical fibers and
Advantage of semiconductor diode over vaccum tubes The semiconductor diode has very small interelectrode capacitances. This is very important in high frequency application. The semiconductor diode does not produce any current in the absence of applied voltage.
Some of the common terms (IC terminology) are defined below: Bonding – attachment of wires to an IC. Chip – an extremely small part of a silicon on wafer on which IC is fabricated. One Si wafer
Advantages of IC The entire physical size of IC is extremely small than that of discrete circuit. The weight of an IC is very less as compared entire discrete circuits. It’s more reliable. Because of their smaller
Following are the difference between linear integrated circuits and digital integrated circuits: Linear ICs Digital ICs Linear ICs (Linear Integrated Circuits) are called as analog IC. Digital ICs (Digital Integrated Circuits) are also called as non linear
Following are the difference between monolithic ic and hybrid ic. Monolithic ICs Hybrid ICs Monolithic integrated circuits which are fabricated entirely on a single chips. Hybrid integrated circuits are fabricated by inter- connecting a number of individual chips. A
We have many semiconductor materials in use. But why we use most of the SILICON for manufacturing the ICs (Integrated Circuit). For this may have a following reasons- It is chemically simple and is not subjected to
Some of the common terms (IC terminology) are defined below: Bonding – attachment of wires to an IC. Chip – an extremely small part of a silicon on wafer on which IC is fabricated. One Si wafer of 2